DocumentCode
162450
Title
Dependence of Ti/C ratio on Ohmic contact with tic electrode for AlGaN/GaN structure
Author
Okamoto, Mitsuo ; Kakushima, K. ; Kataoka, Yasuyuki ; Nishiyama, A. ; Sugii, Nobuyuki ; Wakabayashi, H. ; Tsutsui, K. ; Iwai, Hisato ; Saito, Wataru
Author_Institution
Frontier Res. Center, Tokyo Inst. of Technol., Yokohama, Japan
fYear
2014
fDate
13-15 Oct. 2014
Firstpage
94
Lastpage
97
Abstract
The dependency of Ti atom composition in Ti-C mixed electrodes on Ohmic characteristics for AlGaN/GaN structure is examined by elucidating the role of both Ti and C atoms. Owing to AlGaN surface reduction by reaction with C atoms with thermal treatment, an enhanced reaction of Ti atoms and AlGaN layer has been confirmed. The border of reactive layer and the remaining AlGaN layer has shown rather uniform interface, which is contrast to conventional metallic spike formation. Higher Ti atom composition has revealed lower Ohmic contact resistance, especially 2.6 Ωmm with Ti:C of 5:1. The proposed reaction mechanism gives a new guideline to achieve uniform electron conduction for lower contact resistance.
Keywords
III-V semiconductors; aluminium compounds; contact resistance; electrodes; gallium compounds; ohmic contacts; titanium compounds; wide band gap semiconductors; AlGaN-GaN; Ohmic contact resistance; TiC; atom composition; conventional metallic spike formation; electron conduction; mixed electrodes; resistivity 2.2 ohmmm; surface reduction; Aluminum gallium nitride; Annealing; Atomic layer deposition; Electrodes; Gallium nitride; Ohmic contacts;
fLanguage
English
Publisher
ieee
Conference_Titel
Wide Bandgap Power Devices and Applications (WiPDA), 2014 IEEE Workshop on
Conference_Location
Knoxville, TN
Type
conf
DOI
10.1109/WiPDA.2014.6964631
Filename
6964631
Link To Document