DocumentCode :
162450
Title :
Dependence of Ti/C ratio on Ohmic contact with tic electrode for AlGaN/GaN structure
Author :
Okamoto, Mitsuo ; Kakushima, K. ; Kataoka, Yasuyuki ; Nishiyama, A. ; Sugii, Nobuyuki ; Wakabayashi, H. ; Tsutsui, K. ; Iwai, Hisato ; Saito, Wataru
Author_Institution :
Frontier Res. Center, Tokyo Inst. of Technol., Yokohama, Japan
fYear :
2014
fDate :
13-15 Oct. 2014
Firstpage :
94
Lastpage :
97
Abstract :
The dependency of Ti atom composition in Ti-C mixed electrodes on Ohmic characteristics for AlGaN/GaN structure is examined by elucidating the role of both Ti and C atoms. Owing to AlGaN surface reduction by reaction with C atoms with thermal treatment, an enhanced reaction of Ti atoms and AlGaN layer has been confirmed. The border of reactive layer and the remaining AlGaN layer has shown rather uniform interface, which is contrast to conventional metallic spike formation. Higher Ti atom composition has revealed lower Ohmic contact resistance, especially 2.6 Ωmm with Ti:C of 5:1. The proposed reaction mechanism gives a new guideline to achieve uniform electron conduction for lower contact resistance.
Keywords :
III-V semiconductors; aluminium compounds; contact resistance; electrodes; gallium compounds; ohmic contacts; titanium compounds; wide band gap semiconductors; AlGaN-GaN; Ohmic contact resistance; TiC; atom composition; conventional metallic spike formation; electron conduction; mixed electrodes; resistivity 2.2 ohmmm; surface reduction; Aluminum gallium nitride; Annealing; Atomic layer deposition; Electrodes; Gallium nitride; Ohmic contacts;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wide Bandgap Power Devices and Applications (WiPDA), 2014 IEEE Workshop on
Conference_Location :
Knoxville, TN
Type :
conf
DOI :
10.1109/WiPDA.2014.6964631
Filename :
6964631
Link To Document :
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