• DocumentCode
    162450
  • Title

    Dependence of Ti/C ratio on Ohmic contact with tic electrode for AlGaN/GaN structure

  • Author

    Okamoto, Mitsuo ; Kakushima, K. ; Kataoka, Yasuyuki ; Nishiyama, A. ; Sugii, Nobuyuki ; Wakabayashi, H. ; Tsutsui, K. ; Iwai, Hisato ; Saito, Wataru

  • Author_Institution
    Frontier Res. Center, Tokyo Inst. of Technol., Yokohama, Japan
  • fYear
    2014
  • fDate
    13-15 Oct. 2014
  • Firstpage
    94
  • Lastpage
    97
  • Abstract
    The dependency of Ti atom composition in Ti-C mixed electrodes on Ohmic characteristics for AlGaN/GaN structure is examined by elucidating the role of both Ti and C atoms. Owing to AlGaN surface reduction by reaction with C atoms with thermal treatment, an enhanced reaction of Ti atoms and AlGaN layer has been confirmed. The border of reactive layer and the remaining AlGaN layer has shown rather uniform interface, which is contrast to conventional metallic spike formation. Higher Ti atom composition has revealed lower Ohmic contact resistance, especially 2.6 Ωmm with Ti:C of 5:1. The proposed reaction mechanism gives a new guideline to achieve uniform electron conduction for lower contact resistance.
  • Keywords
    III-V semiconductors; aluminium compounds; contact resistance; electrodes; gallium compounds; ohmic contacts; titanium compounds; wide band gap semiconductors; AlGaN-GaN; Ohmic contact resistance; TiC; atom composition; conventional metallic spike formation; electron conduction; mixed electrodes; resistivity 2.2 ohmmm; surface reduction; Aluminum gallium nitride; Annealing; Atomic layer deposition; Electrodes; Gallium nitride; Ohmic contacts;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wide Bandgap Power Devices and Applications (WiPDA), 2014 IEEE Workshop on
  • Conference_Location
    Knoxville, TN
  • Type

    conf

  • DOI
    10.1109/WiPDA.2014.6964631
  • Filename
    6964631