DocumentCode :
1624807
Title :
A one-dimensional thermal model for planar integrated reactive modules
Author :
Zhao, L. ; Odendaal, W.G. ; Strydom, J.T. ; van Wyk, J.D.
Author_Institution :
Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Volume :
4
fYear :
2001
Firstpage :
2211
Abstract :
Thermal management is a key design aspect of planar integrated reactive modules. In this paper, a simple one-dimensional thermal model based on the control volume method is presented, which can be incorporated as an integral part of the design algorithm. It also requires significantly less computing time and resources than numerical software such as Flotherm. The simulation results and the experimental results are presented and compared in a case study.
Keywords :
modules; thermal analysis; thermal conductivity; thermal management (packaging); L-C/L-C-T module; control volume method; module thickness; one-dimensional thermal model; planar integrated reactive modules; simulation; thermal conductivity; thermal management; volumetric heat generation; Algorithm design and analysis; Ceramics; Conducting materials; Energy management; Power electronics; Power system management; Power system modeling; Thermal conductivity; Thermal management; Tiles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industry Applications Conference, 2001. Thirty-Sixth IAS Annual Meeting. Conference Record of the 2001 IEEE
Conference_Location :
Chicago, IL, USA
ISSN :
0197-2618
Print_ISBN :
0-7803-7114-3
Type :
conf
DOI :
10.1109/IAS.2001.955932
Filename :
955932
Link To Document :
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