A step towards MCM design automation

The implementation of complex electronic systems using high density packaging (HDP) technologies requires an IC-like “right first-time” design approach, as rework and prototyping for such technologies can be extremely expensive. On the other hand, most multichip module (MCM) and HDP technologies have not yet reached a mature stage. Highly integrated and versatile MCM design environments, able to provide an automated design data flow and to cope with the required flexibility, are therefore a necessity. Available MCM CAD tools are an adaptation of PCB tools, and cannot provide the required features. This paper shows the current limitations from a general viewpoint and outlines a minimum set of features which an optimised MCM design environment should offer. The paper also describes the development of an integrated design environment tailored for MCM-D technologies