• DocumentCode
    1625337
  • Title

    Degradation Phenomenon of Electrical Contacts by 3-D Oscillating Mechanism:3-D Oscillating Mechanism for Trial

  • Author

    Wada, Shin-ichi ; Sawa, Koichiro

  • Author_Institution
    R&D Dept., TMC Syst. Co., Ltd., Kawasaki
  • fYear
    2008
  • Firstpage
    284
  • Lastpage
    293
  • Abstract
    The authors have developed the mechanism which gives real vibration to electrical contacts by hammering oscillation in the vertical direction and also a sliding contact mechanism by a magnetostrictive actuator. By using both mechanisms, the influences of a micro-oscillating on contact resistance are examined. Further, 3D oscillation mechanism has been designed to simulate real vibrations that expanded 1D oscillation mechanism (that is to say hammering oscillation mechanism and sliding contact mechanism) into 3D. And the fundamental characteristics of the mechanism are obtained, such as acceleration and displacement at various frequencies, output wave forms to sinusoidal inputs, and mechanical interferences in the X, Y, and Z-directions of the stage. Experimental results suggested that the mechanism could detect more real degradation phenomenon on contacts by the influences of micro-vibration. However, it is necessary that the mechanism should be improved, for instance, in precision mechanism and in feedback control.
  • Keywords
    actuators; contact resistance; electrical contacts; electromagnetic oscillations; interference; magnetostrictive devices; vibrations; contact resistance; degradation phenomenon; electrical contact; hammering oscillation; magnetostrictive actuator; mechanical interference; microoscillation; microvibration; oscillating mechanism; sinusoidal input; sliding contact; Acceleration; Actuators; Computational modeling; Connectors; Contact resistance; Degradation; Frequency; Magnetic materials; Magnetostriction; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 2008. Proceedings of the 54th IEEE Holm Conference on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4244-1901-2
  • Electronic_ISBN
    978-1-4244-1902-9
  • Type

    conf

  • DOI
    10.1109/HOLM.2008.ECP.57
  • Filename
    4694958