Title :
Inlay Clad Metal for High Temperature Connector Applications
Author :
Chen, Lichun Leigh ; Njoes, Barry ; Williams, David W M
Author_Institution :
Tech. Mater., Inc., Lincoln, RI
Abstract :
An ultra-thin AuPdAgNi contact alloy inlay system has been developed and examined for high temperature connector applications. Electrical contact resistance was evaluated after exposure at elevated temperatures in air or in humidity. Different hard-Au-electroplating systems were also used for comparisons. It showed that the inlay system had superior electrical contact characteristics than the electroplating systems.
Keywords :
cladding techniques; electrical contacts; electroplating; gold alloys; nickel alloys; palladium alloys; silver alloys; Inlay clad metal; electrical contact resistance; hard-Au-electroplating systems; high temperature connector; ultra-thin contact alloy inlay system; Connectors; Contact resistance; Costs; Electric resistance; Gold alloys; Humidity; Inorganic materials; Surface resistance; Temperature; Testing;
Conference_Titel :
Electrical Contacts, 2008. Proceedings of the 54th IEEE Holm Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-1901-2
Electronic_ISBN :
978-1-4244-1902-9
DOI :
10.1109/HOLM.2008.ECP.60
