Title :
Issues in chip-package codesign with MCM-D/flip-chip technology
Author :
Franzon, Paul ; Schaffer, Toby ; Lipa, Steve ; Glaser, Alan
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
By distributing on-chip global power, ground, and clock planes on a thin film MCM, the IC can be made smaller, faster, and less noisy while consuming less power. These advantages are demonstrated by a number of case studies: two demonstrator ICs and an analysis of the DEC Alpha 21264 clock distribution scheme. However, there are a number of practical issues that need to be addressed, including process variations and test. In this paper, we present the case studies and a treatment of these practical issues
Keywords :
clocks; flip-chip devices; integrated circuit design; integrated circuit packaging; integrated circuit testing; multichip modules; DEC Alpha 21264 clock distribution scheme; IC noise; IC power consumption; IC size; IC speed; MCM-D/flip-chip technology; chip-package codesign; demonstrator ICs; on-chip global clock planes; on-chip global ground planes; on-chip global power planes; process variations; testing; thin film MCM; CMOS technology; Clocks; Logic testing; Monitoring; Noise generators; Statistical analysis; Switches; Threshold voltage;
Conference_Titel :
IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-8433-X
DOI :
10.1109/IPDI.1998.663634
