Design considerations for single package radio/spl trade/ (SPR) solution for EGSM/DCS dual band cellular phones

Author

Megahed, M. ; Ngompe, E. ; Ayvazian, M. ; Glasbrener, M.

Author_Institution

Skyworks Solution Inc., Newport Beach, CA, USA

Volume

3

fYear

2003

Firstpage

1707

Abstract

A fully integrated front end radio on SPR, that provides a hybrid SOC and SIP solution, is presented. The SPR includes DCR transceiver, PA, directional coupler detector and FEM implemented on different die technologies plus discrete SAW, LPF, and diplexer in addition to embedded and discrete SMT components. The module is implemented on a low cost 4-layer MCM laminate substrate and its size is equal to 13/spl times/13/spl times/1.8 mm. The area saving on PCB phone boards by using the SPR is about 1/4 the discrete solution implementation. Results show that the complete radio integration can be successfully integrated on SPR.

Keywords

UHF power amplifiers; cellular radio; multichip modules; surface mount technology; system-on-chip; transceivers; DCR transceiver; EGSM/DCS dual band cellular phones; LPF; PCB phone boards; SAW; area saving; complete radio integration; design considerations; die technologies; diplexer; directional coupler detector; discrete SMT components; embedded SMT components; front end module; fully integrated front end radio; hybrid SOC SIP solution; low cost 4-layer MCM laminate substrate; power amplifier; single package radio solution; system in package; system integration on chip; Cellular phones; Costs; Detectors; Directional couplers; Distributed control; Dual band; Packaging; Surface acoustic waves; Surface-mount technology; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2003 IEEE MTT-S International

Conference_Location

Philadelphia, PA, USA

ISSN

0149-645X

Print_ISBN

0-7803-7695-1

Type

conf

DOI

10.1109/MWSYM.2003.1210468

Filename

1210468