Quality issues of high pin count fine pitch VLSI packages

The continuous demand for both high-speed integrated circuits of all types and increased on-chip circuitry density is fueling the need for high-pin-count (>256), fine-line (⩽20 mil) packages. In the past the package served primarily as mechanical protection for the chip and as a convenient way to bring signals from the chip to the next level of packaging. With the rapid growth in the use of VLSI circuits, increasing thought must be given to the design of the package. The authors show that the quality of high-pin-count, fine-pitch VLSI packages is complex and dependent on a multiplicity of issues: electrical, testing and tester, thermal management, and materials/interface. They conclude that each of these must be addressed to yield a quality package. Further, the limiting factors to the widespread use of VLSI circuits will be the ability to test these devices accurately and effectively, as well as the ability to package the die reliably and provide an efficient connection to the external world