MCM-D implementation of passive RF components: Chip/package tradeoffs

Author

Frye, Robert C.

Author_Institution

AT&T Bell Labs., Murray Hill, NJ, USA

fYear

1998

Firstpage

100

Lastpage

104

Abstract

MCM-D technology offers the capability to integrate passive components with ICs. Currently, most application volume is in a frequency range between 800 MHz and 2 GHz. On-chip integration of inductors in this range poses particular problems because of the conflicting needs for small size and high quality factor. MCM technology offers a way to tightly integrate inductors and capacitors in a more cost-effective fashion. To use this approach to its best advantage requires closely coupled design of ICs and substrate and calls for new design methodologies that can work across different technologies

Keywords

Q-factor; UHF integrated circuits; capacitors; inductors; integrated circuit design; integrated circuit packaging; multichip modules; resistors; 800 MHz to 2 GHz; MCM-D; MCM-D passive RF component implementation; MCM-D technology; application volume; capacitors; chip/package trade-offs; coupled IC/substrate design; design methodologies; inductor size; inductors; on-chip integration; passive RF components; passive component integration; quality factor; Capacitors; Chip scale packaging; Costs; Inductance; Inductors; Insulation; Integrated circuit packaging; Q factor; Radio frequency; Radiofrequency integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-8433-X

Type

conf

DOI

10.1109/IPDI.1998.663637

Filename

663637