• DocumentCode
    1627409
  • Title

    Lossy substrate and resonance analysis of embedded inductors

  • Author

    Zhao, Jinsong ; Dai, Wayne ; Kapur, Sharad ; Long, David

  • Author_Institution
    Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
  • fYear
    1998
  • Firstpage
    109
  • Lastpage
    114
  • Abstract
    Integrated spiral inductors, while practically desirable and technologically feasible, challenge the modeling efforts by their half-distributed and half-lumped nature and substrate loss at high frequencies. In this paper, we examine these effects by full-wave solving. Full-wave Green´s functions are developed, which capture the substrate coupling and loss effects. It is shown that the substrate loss is the main factor determining the quality factor of integrated inductors. MCM technology demonstrates its substantial advantage over regular CMOS processes in implementing high Q inductors
  • Keywords
    CMOS integrated circuits; Green´s function methods; Q-factor; UHF devices; inductors; integrated circuit modelling; integrated circuit packaging; losses; multichip modules; resonance; CMOS processes; HF substrate loss; MCM technology; embedded inductors; full-wave Green´s functions; full-wave solving; half-distributed/half-lumped inductor nature; high Q inductors; integrated inductors; integrated spiral inductors; lossy substrate analysis; modeling; quality factor; resonance analysis; substrate coupling effects; substrate loss; substrate loss effects; Capacitors; Equivalent circuits; Green´s function methods; Inductors; Integral equations; Q factor; Resistors; Resonance; Resonant frequency; Spirals;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-8433-X
  • Type

    conf

  • DOI
    10.1109/IPDI.1998.663640
  • Filename
    663640