DocumentCode
1627409
Title
Lossy substrate and resonance analysis of embedded inductors
Author
Zhao, Jinsong ; Dai, Wayne ; Kapur, Sharad ; Long, David
Author_Institution
Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
fYear
1998
Firstpage
109
Lastpage
114
Abstract
Integrated spiral inductors, while practically desirable and technologically feasible, challenge the modeling efforts by their half-distributed and half-lumped nature and substrate loss at high frequencies. In this paper, we examine these effects by full-wave solving. Full-wave Green´s functions are developed, which capture the substrate coupling and loss effects. It is shown that the substrate loss is the main factor determining the quality factor of integrated inductors. MCM technology demonstrates its substantial advantage over regular CMOS processes in implementing high Q inductors
Keywords
CMOS integrated circuits; Green´s function methods; Q-factor; UHF devices; inductors; integrated circuit modelling; integrated circuit packaging; losses; multichip modules; resonance; CMOS processes; HF substrate loss; MCM technology; embedded inductors; full-wave Green´s functions; full-wave solving; half-distributed/half-lumped inductor nature; high Q inductors; integrated inductors; integrated spiral inductors; lossy substrate analysis; modeling; quality factor; resonance analysis; substrate coupling effects; substrate loss; substrate loss effects; Capacitors; Equivalent circuits; Green´s function methods; Inductors; Integral equations; Q factor; Resistors; Resonance; Resonant frequency; Spirals;
fLanguage
English
Publisher
ieee
Conference_Titel
IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-8433-X
Type
conf
DOI
10.1109/IPDI.1998.663640
Filename
663640
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