Reliability of solder joints in High-power LED package in power cycling tests

Author

Deng, Haitao ; Feng, Shiwei ; Guo, Chunsheng ; Qiao, Yanbin ; Zhang, Guangchen

Author_Institution

Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China

fYear

2010

Firstpage

1683

Lastpage

1685

Abstract

In this paper, an improved method to investigate the reliability of solder joint between High-power LED chip and heat sink is presented. The power cycling is carried out through the switching on and off of the current stress. The optical and electrical characteristics do not degrade apparently. Electrical method is used to measure the thermal resistance of high-power LED which increases from 15.81°C/W to 43.95°C/W for typical one of three samples before and after power cycling. Furthermore, some voids are observed in solder joint after power cycling according to the result of scanning acoustic microscope (SAM). That is, the solder joint degrade significantly after power cycling. Our results indicate that this method can effectually evaluate the reliability of solder joint.

Keywords

acoustic microscopes; heat sinks; light emitting diodes; reliability; solders; heat sink; high-power LED package; power cycling tests; reliability; scanning acoustic microscope; solder joints; Heat sinks; Junctions; Light emitting diodes; Reliability; Soldering; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-5797-7

Type

conf

DOI

10.1109/ICSICT.2010.5667288

Filename

5667288