• DocumentCode
    1627745
  • Title

    Propagation characteristics of substrate integrated waveguide based on LTCC

  • Author

    Hao Li ; Wei Hong ; Tie Jun Cui ; Ke Wu ; Yu Lin Zhang ; Li Yan

  • Author_Institution
    Dept. of Radio Eng., Southeast Univ., Nanjing, China
  • Volume
    3
  • fYear
    2003
  • Firstpage
    2045
  • Abstract
    The substrate integrated waveguide (SIW) is a new type of guided wave structure fabricated with periodic metallic via holes in a multilayered LTCC substrate. The SIW takes the advantages of both waveguide and microstrip structures, like the high-Q factor, high power capacity, small size, and the possibility of integration. In this paper, the propagation characteristics of the SIW are investigated, based on a finite difference method by using appropriate absorbing boundary conditions. A special treatment has been made in the interaction of the incident wave with the SIW structure. Simulated results are given to test the validity and efficiency of the proposed method, from which very interesting phenomena have been found in the SIW.
  • Keywords
    Q-factor; ceramic packaging; computational electromagnetics; finite difference methods; frequency-domain analysis; periodic structures; rectangular waveguides; FDFD; LTCC based substrate integrated waveguide propagation characteristics; SIW guided wave structure power capacity; SIW structure/incident wave interaction; absorbing boundary conditions; finite difference frequency domain analysis; high-Q factor; microstrip structures; multilayered LTCC substrate periodic metallic via holes; rectangular waveguide embedded periodic structures; waveguide structures; Boundary conditions; Finite difference methods; Frequency domain analysis; Laboratories; Microstrip; Millimeter wave propagation; Periodic structures; Radio frequency; Rectangular waveguides; Waveguide components;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2003 IEEE MTT-S International
  • Conference_Location
    Philadelphia, PA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-7695-1
  • Type

    conf

  • DOI
    10.1109/MWSYM.2003.1210562
  • Filename
    1210562