DocumentCode
1627966
Title
4H-SiC DMOSFETs for power conversion applications successes and ongoing challenges
Author
Hull, Brett ; Zhang, Jon ; Das, Mrinal ; Ryu, Sei-Hyung ; Jonas, Charlotte ; Dhar, Sarit ; Haney, Sarah ; Callanan, Robert ; Richmond, Jim
Author_Institution
Cree, Inc., Durham, NC, USA
fYear
2010
Firstpage
197
Lastpage
200
Abstract
Power devices fabricated in 4H-SiC are poised to significantly impact the field of power electronics. There has been great interest in SiC as a material in which to fabricate power electronic devices for quite some time based on its very promising fundamental materials properties. However, it has been far more recently that the potential of SiC is being appreciated as a result of the recent advances in material quality, fabrication processes and device design. Based on the high critical breakdown electric field, high bandgap and high thermal conductivity of SiC, systems that are specifically designed to take advantage of these characteristics offer superior power density, lower cooling requirements, and prolonged survivability in adverse conditions when compared to systems fabricated with Si power devices.
Keywords
MOSFET; power semiconductor devices; silicon compounds; 4H-SiC DMOSFETs; SiC; cooling requirements; device design; fabrication process; high bandgap; high critical breakdown electric field; high thermal conductivity; material quality; materials properties; power conversion application; power density; power electronic devices; Leakage current; Logic gates; Resistance; Silicon; Silicon carbide; Switches; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference (DRC), 2010
Conference_Location
South Bend, IN
ISSN
1548-3770
Print_ISBN
978-1-4244-6562-0
Electronic_ISBN
1548-3770
Type
conf
DOI
10.1109/DRC.2010.5551909
Filename
5551909
Link To Document