• DocumentCode
    1627966
  • Title

    4H-SiC DMOSFETs for power conversion applications successes and ongoing challenges

  • Author

    Hull, Brett ; Zhang, Jon ; Das, Mrinal ; Ryu, Sei-Hyung ; Jonas, Charlotte ; Dhar, Sarit ; Haney, Sarah ; Callanan, Robert ; Richmond, Jim

  • Author_Institution
    Cree, Inc., Durham, NC, USA
  • fYear
    2010
  • Firstpage
    197
  • Lastpage
    200
  • Abstract
    Power devices fabricated in 4H-SiC are poised to significantly impact the field of power electronics. There has been great interest in SiC as a material in which to fabricate power electronic devices for quite some time based on its very promising fundamental materials properties. However, it has been far more recently that the potential of SiC is being appreciated as a result of the recent advances in material quality, fabrication processes and device design. Based on the high critical breakdown electric field, high bandgap and high thermal conductivity of SiC, systems that are specifically designed to take advantage of these characteristics offer superior power density, lower cooling requirements, and prolonged survivability in adverse conditions when compared to systems fabricated with Si power devices.
  • Keywords
    MOSFET; power semiconductor devices; silicon compounds; 4H-SiC DMOSFETs; SiC; cooling requirements; device design; fabrication process; high bandgap; high critical breakdown electric field; high thermal conductivity; material quality; materials properties; power conversion application; power density; power electronic devices; Leakage current; Logic gates; Resistance; Silicon; Silicon carbide; Switches; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference (DRC), 2010
  • Conference_Location
    South Bend, IN
  • ISSN
    1548-3770
  • Print_ISBN
    978-1-4244-6562-0
  • Electronic_ISBN
    1548-3770
  • Type

    conf

  • DOI
    10.1109/DRC.2010.5551909
  • Filename
    5551909