DocumentCode :
1628036
Title :
Simulation and characterization of a high temperature SIMOX-operational amplifier
Author :
Gehse, P. ; Eisenhut, C.
Author_Institution :
Inst. for Electron., Ruhr-Univ., Bochum, Germany
fYear :
1995
Firstpage :
459
Lastpage :
462
Abstract :
For conventional junction isolated silicon integrated circuits, leakage currents increase with temperature. These currents across reverse bias junctions can easily modify circuit performance and even cause latch up. SOI (Silicon On Isolator) devices greatly minimize such leakage currents. Realizing high temperature linear circuits the SIMOX (Separation by IMplantation of OXygen) technology is used, because this technology can produce fully depleted thin-film MOSFETs with high electrical performance. In this paper a simple SIMOX-model, which is verificated in dependence on temperature and back-gate potential is presented. By the help of this model linear circuits (i.e.: operational amplifiers (OPA), voltage references, etc.) are developed, which can be operated up to 300°C. Furthermore, first long-term examinations are accomplished to predict the reliability of SIMOX-MOSFETs at high temperatures
Keywords :
MOS analogue integrated circuits; MOSFET circuits; SIMOX; circuit analysis computing; high-temperature techniques; operational amplifiers; 300 C; SOI device; back-gate potential; fully depleted thin-film MOSFET; high temperature SIMOX operational amplifier; leakage current; linear circuit; reliability; silicon integrated circuit; simulation; voltage reference; Circuit optimization; Circuit simulation; Integrated circuit technology; Isolation technology; Isolators; Latches; Leakage current; Linear circuits; Silicon; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signals, Systems, and Electronics, 1995. ISSSE '95, Proceedings., 1995 URSI International Symposium on
Conference_Location :
San Francisco
Print_ISBN :
0-7803-2516-8
Type :
conf
DOI :
10.1109/ISSSE.1995.498031
Filename :
498031
Link To Document :
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