Title :
Redundancies and don´t cares in sequential logic synthesis
Author :
Devadas, Srinivas ; Ma, Hi-keung Tony ; Newton, A. Richard
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
Abstract :
The authors explore the relationships between redundant logic and don´t care conditions in sequential circuits. Stuck-at faults in a sequential circuit may be testable in the combinational sense but may be redundant because they do not alter the terminal behavior of a nonscan sequential machine. These sequential redundancies result in a faulty state transition graph (STG) that is equivalent to the STG of the true machine. The authors present a classification of redundant faults in sequential circuits composed of single or interacting finite-state machines. Don´t care sets can be defined for each class of redundancy, and optimally exploiting these don´t care conditions results in the implicit elimination of any such redundancies in a given circuit. In cascaded and interconnected sequential circuits, sequential don´t cares are required to eliminate redundancies. The authors present preliminary experimental results which indicate that by exploiting these don´t cares medium-sized irredundant sequential circuits can be synthesized with no area overhead and within reasonable CPU times
Keywords :
automatic testing; finite automata; logic CAD; logic testing; redundancy; sequential circuits; CPU times; cascaded sequential circuits; classification of redundant faults; don´t care conditions; faulty state transition graph; interacting finite-state machines; interconnected sequential circuits; logic CAD; logic testing; nonscan sequential machine; redundant logic; sequential logic synthesis; sequential redundancies; single finite state machine; stuck-at faults; Automata; Circuit faults; Circuit synthesis; Circuit testing; Combinational circuits; Logic testing; Minimization; Redundancy; Sequential analysis; Sequential circuits;
Conference_Titel :
Test Conference, 1989. Proceedings. Meeting the Tests of Time., International
Conference_Location :
Washington, DC
DOI :
10.1109/TEST.1989.82332