DocumentCode :
1628701
Title :
The analysis of non-homogeneity of SAW velocity in langasite
Author :
Sakharov, S.A. ; Buzanov, O.A. ; Medvedev, A.V. ; Kondratiev, S.N. ; Girardet, E. ; Thorvaldsson, T.
Author_Institution :
Fomos Technol., Moscow, Russia
fYear :
2001
fDate :
6/23/1905 12:00:00 AM
Firstpage :
244
Lastpage :
249
Abstract :
The research results of the influence of different technology parameters of crystal growth and device manufacturing process on SAW velocity variation on langasite (LGS) wafers Ø 3" are presented. The wafers were made from crystals grown by the Czochralski method along <00.1> and <01.1> directions. The paper also gives a technology process description of langasite crystal growth along <01.1> direction and of making Ø 3" wafers. SAW velocity measurements were performed utilizing specially developed test structures. The test structures were also used to estimate the device sensitivity due to electrode thickness and electrode width variations of the manufacturing process.. Advantages of LGS wafers for possible SAW device applications are discussed. Due to good temperature stability and a moderately high electromechanical coupling coefficient, langasite is known as a promising material for SAW devices. The filters on LGS have exhibited better electrical parameters than their analogues on quartz and lithium tantalate. In order to demonstrate a practical filter application on LGS, a SAW filter at the center frequency of 114.99 MHz was designed and realized. The chip fits into a 3.8×3.8 mm2 SMD package. Measured performance is in excellent agreement with the predicted response and the chip size was dramatically reduced compared to the state-of-the-art for this kind of filter
Keywords :
VHF filters; acoustic wave velocity; crystal growth from melt; gallium compounds; lanthanum compounds; piezoelectric materials; surface acoustic wave filters; surface acoustic wave resonators; surface acoustic waves; 114.99 MHz; 3 in; 3.8 mm; Czochralski method; LGS wafers; La3Ga5SiO14; SAW device applications; SAW filter application; SAW velocity measurements; SAW velocity variation; SMD package; crystal growing; device sensitivity; electrode-thickness variations; electrode-width variations; electromechanical coupling coefficient; langasite wafers; manufacturing process; technology parameters; temperature stability; test structures; Crystals; Electrodes; Filters; Manufacturing processes; Paper technology; Performance evaluation; Surface acoustic wave devices; Surface acoustic waves; Testing; Velocity measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frequency Control Symposium and PDA Exhibition, 2001. Proceedings of the 2001 IEEE International
Conference_Location :
Seattle, WA
ISSN :
1075-6787
Print_ISBN :
0-7803-7028-7
Type :
conf
DOI :
10.1109/FREQ.2001.956196
Filename :
956196
Link To Document :
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