DocumentCode
1628789
Title
Flatband voltage tuning and EOT reduction for SiO2 /HfO2 /TiN gate stacks via lanthanum oxide capping layers using two different lanthanum precursors
Author
Chiang, C.K. ; Huang, H.Y. ; Wu, C.H. ; Lin, J.F. ; Liu, C.C. ; Yang, C.L. ; Wu, J.Y. ; Wang, S.J.
fYear
2010
Firstpage
59
Lastpage
60
Abstract
We have investigated the precursor effect of La2O3 cap layers on Vfb tuning and EOT reduction in SiO2/HfO2/TiN gate stacks. The Vfb tuning and EOT reduction correlate with the intermixing of La2O3 and HfO2 dielectrics which forms dipoles at the lower interface between HfO2 and SiO2 IL and the diffusion of La and Hf atoms to the SiO2 IL. The use of La(fAMD)3 precursor for the La2O3 cap layer deposition has been shown being much superior to La(thd)3 due to lower ALD process temperature and shorter O3 oxidant pulse duration.
Keywords
IV-VI semiconductors; hydrogen compounds; lanthanum compounds; leakage currents; silicon compounds; titanium compounds; tunnelling; ALD process temperature; EOT reduction; HfO2; La(fAMD)3 precursor; La(thd)3 precursor; La2O3; SiO2; TiN; flatband voltage tuning; lanthanum oxide capping layers; lanthanum precursors;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference (DRC), 2010
Conference_Location
South Bend, IN
ISSN
1548-3770
Print_ISBN
978-1-4244-6562-0
Electronic_ISBN
1548-3770
Type
conf
DOI
10.1109/DRC.2010.5551940
Filename
5551940
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