Title :
Defect detection and identification in textile fabrics using Multi Resolution Combined Statistical and Spatial Frequency Method
Author :
Sabeenian, R.S. ; Paramasivam, M.E.
Author_Institution :
ECE & Centre Head, Sona Coll. of Technol., Salem, India
Abstract :
In textile industry, reliable and accurate quality control and inspection becomes an important element. Presently, this is still accomplished by human experience, which is more time consuming and is also prone to errors. Hence automated visual inspection systems become mandatory in textile industries. This Paper presents a novel algorithm of fabric defect detection by making use of multi resolution combined statistical and spatial frequency method. Defect detection consists of two phases, first is the training and next is the testing phase. In the training phase, the reference fabric images are cropped into non-overlapping sub-windows. By applying MRCSF the features of the textile fabrics are extracted and stored in the database. During the testing phase the same procedure is applied for test fabric and the features are compared with database information. Based on the comparison results, each sub-window is categorized as defective or non-defective. The classification rate obtained by the process of simulation using MATLAB was found to be 99%.
Keywords :
fabrics; feature extraction; inspection; maintenance engineering; object detection; production engineering computing; quality control; statistical analysis; MATLAB simulation; automated visual inspection systems; defect detection; fabric defect detection algorithm; feature extraction; multiresolution combined statistical and spatial frequency method; quality control; reference fabric images; textile fabric identification; textile industry; Fabrics; Frequency; Image databases; Industrial training; Inspection; Quality control; Spatial databases; Spatial resolution; Testing; Textile industry; Defect detection; GLCM; MRCSF; MRFM; Spatial Frequency; Textile Fabric; Texture;
Conference_Titel :
Advance Computing Conference (IACC), 2010 IEEE 2nd International
Conference_Location :
Patiala
Print_ISBN :
978-1-4244-4790-9
Electronic_ISBN :
978-1-4244-4791-6
DOI :
10.1109/IADCC.2010.5423017