Title :
High performance multilayered high temperature cofired ceramic for wide band packaging
Author :
Tavernier, C.A. ; Valentin, F. ; Mazouz, M. ; Vigo, R. ; Muffato, W. ; Maeder, P. ; Havasi, M.
Author_Institution :
EGIDE, Trappes, France
Abstract :
Opto-electronic and wireless packages have to meet stringent technical performance and cost. Traditionally glass sealed metal machined packages respond to the demand. In 2003, with ever growing complexity, new technology now offers advantageous solutions. While keeping high hermiticity, low mechanical tolerance and electromagnetic compatibility, multilayered ceramic offers a superior flexibility at a lower cost. The present article provides insight on High Temperature Cofired Ceramic (HTCC) achievable electrical performance in the DC to 40 GHz range based on FEM modeling with Ansoft HFSS. We compare model and experimental results for ring and cavity resonators with quality factor up to 180. Based on the model we then derive wide band asymmetrical stripline and vertical interconnect.
Keywords :
Q-factor; cavity resonators; ceramic packaging; finite element analysis; interconnections; strip lines; 0 to 40 GHz; Ansoft HFSS; FEM model; asymmetrical stripline; cavity resonator; electrical characteristics; electromagnetic compatibility; hermiticity; mechanical tolerance; multilayered high temperature cofired ceramic; optoelectronic package; quality factor; ring resonator; vertical interconnect; wideband packaging; wireless package; Cavity resonators; Ceramics; Costs; Electromagnetic compatibility; Glass; Packaging machines; Q factor; Stripline; Temperature distribution; Wideband;
Conference_Titel :
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location :
Philadelphia, PA, USA
Print_ISBN :
0-7803-7695-1
DOI :
10.1109/MWSYM.2003.1210620
