DocumentCode
1629473
Title
Microshield transmission line and spiral inductor integrated on polymer thick film
Author
Ju-Hyun Ko ; Shin-Seong Ho ; Young-Se Kwon
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., KAIST, Daejon, South Korea
Volume
3
fYear
2003
Firstpage
2281
Abstract
Newly proposed microshield transmission line and spiral inductor are developed on CMOS grade silicon substrate using polymer thick film as a supporter for signal line. The fabricated microshield line shows maximum available gain of less than -0.12dB/mm and return loss of larger than 17dB up to 40GHz. Due to its microshield structure, the coupling from the neighboring signal line is less than -70dB from 0.5GHz to 25GHz. For the inductor of 3.62nH, self resonant frequency of 14.5GHz, and maximum quality factor (Q) of 15.5 at 5.5GHz are obtained. Because the fabrication process is compatible with the conventional standard silicon IC process, it is applicable to silicon RF IC. Multichip module (MCM) package for high performance is also a good branch for these packaging devices.
Keywords
Q-factor; electromagnetic shielding; inductors; integrated circuit packaging; multichip modules; polymer films; radiofrequency integrated circuits; thick films; transmission lines; 0.5 to 25 GHz; 17 dB; 40 GHz; CMOS grade silicon substrate; MCM package; Si; fabrication process; microshield transmission line; polymer thick film; quality factor; return loss; self-resonant frequency; silicon RF IC; spiral inductor; Integrated circuit packaging; Polymer films; Radiofrequency integrated circuits; Resonant frequency; Silicon; Spirals; Substrates; Thick film inductors; Thick films; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location
Philadelphia, PA, USA
ISSN
0149-645X
Print_ISBN
0-7803-7695-1
Type
conf
DOI
10.1109/MWSYM.2003.1210621
Filename
1210621
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