Title :
Electro-optical sensor packaging overview
Author_Institution :
Martin Marietta Electron. & Missile, Orlando, FL, USA
Abstract :
This paper emphasizes the infrared sensor/detector packaging. Electro-optical (E-O) sensor packaging is a challenging task. By its nature, it requires one to complete two missions: 1) to expose the sensing element in order to interact with the environment "transparently" while detecting the surrounding and 2) to protect sensitive electronics from the harsh environment.
Keywords :
failure analysis; infrared detectors; packaging; seals (stoppers); electro-optical sensor; environmental interaction; harsh environment; infrared sensor; sensing element; sensor packaging; Electronic packaging thermal management; Electronics packaging; Electrooptic devices; Glass; Optical materials; Optical sensors; Plastic packaging; Temperature distribution; Temperature sensors; Windows;
Conference_Titel :
Southcon/94. Conference Record
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-9988-9
DOI :
10.1109/SOUTHC.1994.498088
