• DocumentCode
    1630302
  • Title

    Investigation of ESD second breakdown TCAD simulation

  • Author

    Xiaowu, Cai ; Beiping, Yan ; Xiaoyong, Han

  • Author_Institution
    Hong Kong Appl. Sci. & Technol. Res. Inst. Co. Ltd. (ASTRI), Hong Kong, China
  • fYear
    2010
  • Firstpage
    1665
  • Lastpage
    1667
  • Abstract
    This paper presents the methodology to obtain the snapback curves and second breakdown point of an ESD stressed device through TCAD simulation. This method allows an excellent ESD simulation convergence and then good ESD prediction with a significantly reduced computation time. One 0.5um CMOS technology has been simulated for experimental support.
  • Keywords
    CMOS integrated circuits; electronic engineering computing; electrostatic discharge; technology CAD (electronics); CMOS technology; ESD second breakdown TCAD simulation; second breakdown point; size 0.5 mum; snapback curves; Electrostatic discharge; Integrated circuit modeling; Load modeling; Resistors; Silicon; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5797-7
  • Type

    conf

  • DOI
    10.1109/ICSICT.2010.5667387
  • Filename
    5667387