DocumentCode
1630302
Title
Investigation of ESD second breakdown TCAD simulation
Author
Xiaowu, Cai ; Beiping, Yan ; Xiaoyong, Han
Author_Institution
Hong Kong Appl. Sci. & Technol. Res. Inst. Co. Ltd. (ASTRI), Hong Kong, China
fYear
2010
Firstpage
1665
Lastpage
1667
Abstract
This paper presents the methodology to obtain the snapback curves and second breakdown point of an ESD stressed device through TCAD simulation. This method allows an excellent ESD simulation convergence and then good ESD prediction with a significantly reduced computation time. One 0.5um CMOS technology has been simulated for experimental support.
Keywords
CMOS integrated circuits; electronic engineering computing; electrostatic discharge; technology CAD (electronics); CMOS technology; ESD second breakdown TCAD simulation; second breakdown point; size 0.5 mum; snapback curves; Electrostatic discharge; Integrated circuit modeling; Load modeling; Resistors; Silicon; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-5797-7
Type
conf
DOI
10.1109/ICSICT.2010.5667387
Filename
5667387
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