DocumentCode
1630567
Title
Channel hot-carrier degradation on strained MOSFETs with embedded SiGe or SiC Source/Drain
Author
Amat, E. ; Rodríguez, R. ; González, M.B. ; Martín-Martínez, J. ; Nafría, M. ; Aymerich, X. ; Machkaoutsan, V. ; Bauer, M. ; Verheyen, P. ; Simoen, E.
Author_Institution
Electron. Eng. Dept., Univ. Autonoma de Barcelona, Barcelona, Spain
fYear
2010
Firstpage
1648
Lastpage
1650
Abstract
Channel Hot Carrier (CHC) degradation on uniaxially strained pMOS and nMOS samples with different S/D materials has been analyzed. The results show that the CHC damage is larger in the strained samples in comparison with the unstrained devices, and increases with the temperature.
Keywords
MOSFET; hot carriers; silicon compounds; SiC; SiGe; channel hot-carrier degradation; embedded source-drain; strained MOSFET; uniaxially strained nMOS samples; uniaxially strained pMOS samples; Degradation; Impact ionization; MOSFETs; Silicon carbide; Silicon germanium; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-5797-7
Type
conf
DOI
10.1109/ICSICT.2010.5667396
Filename
5667396
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