Title :
Reusable burn-in carrier system for cut die
Author_Institution :
VLSI Technol. Inc., Tempe, AZ, USA
Abstract :
This paper details a proposed system for burning in sorted die. The system described allows sorted diced die to be electrically stressed at high temperatures for a typical burn-in cycle. Furthermore the system allows the die to be re-screened after the burn-in cycle is completed.
Keywords :
life testing; multichip modules; production testing; MCMs; burn-in cycle; cut die; electrical stress; reusable burn-in carrier system; sorted die; Bonding; Flexible electronics; Manufacturing; Packaging; Pins; Polymer films; Rivers; Substrates; Temperature; Testing;
Conference_Titel :
Southcon/94. Conference Record
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-9988-9
DOI :
10.1109/SOUTHC.1994.498133
