Effect of seed layers on the performance of planar spiral microinductors

Author

Walker, Richard ; Sirotkin, E. ; Terry, J.G. ; Smith, Samuel ; Desmulliez, Marc Philippe Y. ; Walton, A.J.

Author_Institution

Sch. of Eng., Univ. of Edinburgh, Edinburgh, UK

fYear

2014

fDate

24-27 March 2014

Firstpage

135

Lastpage

140

Abstract

This paper reports on the effect of the electrical performance related to magnetic seed layers used within planar power microinductors. These studies involve structural and magnetic characterisation of Ni80Fe20 films electro-deposited on non-magnetic and magnetic seed layers (i.e. copper and nickel respectively). Microelectronic mechanical test structures and xray analysis have been used to characterise the stress levels and structural properties of Ni80Fe20 films electro-deposited on both copper and nickel seed layers. In addition, planar spiral micro-inductors, with patterned magnetic cores, have been fabricated in order to confirm the improvement in the electrical performance from magnetic seed layers, as a result of enhanced magnetic and resistive contribution.

Keywords

electroplating; inductors; magnetic cores; X-ray analysis; electrical performance; magnetic characterisation; magnetic seed layers; microelectronic mechanical test structures; patterned magnetic cores; planar spiral microinductors; stress levels; structural characterisation; Coils; Copper; Inductance; Inductors; Magnetic cores; Nickel; Q-factor;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures (ICMTS), 2014 International Conference on

Conference_Location

Udine

ISSN

1071-9032

Print_ISBN

978-1-4799-2193-5

Type

conf

DOI

10.1109/ICMTS.2014.6841481

Filename

6841481