• DocumentCode
    1631186
  • Title

    New approach to investigate the dynamic relaxation process of complex peak in mechanical and dielectric characteristics of anelastic solids

  • Author

    Kim, Bong Heup

  • Author_Institution
    Dept. of Electr. Eng., Hanyang Univ., Seoul, South Korea
  • Volume
    1
  • fYear
    1997
  • Firstpage
    6
  • Abstract
    Complex dynamic relaxation processes of mechanical as well as dielectric character in polymeric anelastic solids are closely related through the movement of molecular chain segment in morphological structure, and the morphology can easily be modified by the treatments such as mechanical drawing or irradiation, those of which result, in turn, the complicated change on the appearance of the observed complex relaxation peak. In order to extract any meaningful understanding from the modified appearance of the peak, the relaxation peak must be resolved into the sum of the dynamic single relaxation peaks, each of which can be characterized respectively by three factors such as activation energy, magnitude of peak height and peak point temperature on the temperature dependent characteristics
  • Keywords
    anelastic relaxation; dielectric materials; dielectric relaxation; drawing (mechanical); polymers; activation energy; complex dynamic relaxation; dielectric characteristics; drawing; irradiation; mechanical characteristics; molecular chain segment; morphological structure; peak height; peak point temperature; polymeric anelastic solid; Damping; Dielectrics; Frequency; Mechanical variables measurement; Polymers; Shape; Solids; Temperature dependence; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    0-7803-2651-2
  • Type

    conf

  • DOI
    10.1109/ICPADM.1997.617515
  • Filename
    617515