• DocumentCode
    163130
  • Title

    Compressively-stressed test structures for opaque micro-stmctures releasing visualization

  • Author

    Tixier-Mita, Agnes ; Lebrasseur, Eric ; Takahashi, Tatsuro ; Mita, Y. ; Fujita, Hideaki ; Toshiyoshi, Hiroshi ; Olivier, Francais ; Bruno, Le Pioufle

  • Author_Institution
    Univ. of Tokyo, Tokyo, Japan
  • fYear
    2014
  • fDate
    24-27 March 2014
  • Firstpage
    170
  • Lastpage
    173
  • Abstract
    Stressed test structures have been fabricated to precisely determine the releasing time of low stress and opaque MEMS. These test structures will deform as soon as they are released, in contrast to low stress target structures that remain flat. Thanks to the test structures, it becomes possible to detect the releasing with an optical microscope.
  • Keywords
    compressive testing; micromechanical devices; compressively stressed test structures; opaque MEMS; opaque microstructures releasing visualization; optical microscope; Electrodes; Etching; Large scale integration; Microscopy; Silicon; Strain; Stress; LSI; MEMS; dry etching releasing; micro-channel integration; releasing detection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures (ICMTS), 2014 International Conference on
  • Conference_Location
    Udine
  • ISSN
    1071-9032
  • Print_ISBN
    978-1-4799-2193-5
  • Type

    conf

  • DOI
    10.1109/ICMTS.2014.6841488
  • Filename
    6841488
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=163130