Title :
Compressively-stressed test structures for opaque micro-stmctures releasing visualization
Author :
Tixier-Mita, Agnes ; Lebrasseur, Eric ; Takahashi, Tatsuro ; Mita, Y. ; Fujita, Hideaki ; Toshiyoshi, Hiroshi ; Olivier, Francais ; Bruno, Le Pioufle
Author_Institution :
Univ. of Tokyo, Tokyo, Japan
Abstract :
Stressed test structures have been fabricated to precisely determine the releasing time of low stress and opaque MEMS. These test structures will deform as soon as they are released, in contrast to low stress target structures that remain flat. Thanks to the test structures, it becomes possible to detect the releasing with an optical microscope.
Keywords :
compressive testing; micromechanical devices; compressively stressed test structures; opaque MEMS; opaque microstructures releasing visualization; optical microscope; Electrodes; Etching; Large scale integration; Microscopy; Silicon; Strain; Stress; LSI; MEMS; dry etching releasing; micro-channel integration; releasing detection;
Conference_Titel :
Microelectronic Test Structures (ICMTS), 2014 International Conference on
Conference_Location :
Udine
Print_ISBN :
978-1-4799-2193-5
DOI :
10.1109/ICMTS.2014.6841488
