DocumentCode :
163145
Title :
Effects of metal spacing and poly-silicon layers on pulsed-laser single event transient testing
Author :
Jinshun Bi ; Chuanbin Zeng ; Linchun Gao ; Duoli Li ; Gang Liu ; Jiajun Luo ; Zhengsheng Han ; Zhengshen Han
Author_Institution :
Inst. of Microelectron., Beijing, China
fYear :
2014
fDate :
24-27 March 2014
Firstpage :
207
Lastpage :
212
Abstract :
This paper investigates the influence of metal spacing and poly-crystalline silicon gate and silicide technology on single event transients (SETs) occurring in pulsed laser irradiated test patterns based on 0.18 μm partially depleted silicon-on-insulator complementary-metal-oxide-semiconductor technology. Laser-induced transients were measured and analyzed in detail, including SET rise time, fall time, pulse width, pulse maximum, and collected charge. The quantitative dependence of the SET characteristics on metal spacing and silicide processing is reported. This information is useful for optimal design of test structures to evaluate soft errors in integrated circuits.
Keywords :
CMOS integrated circuits; integrated circuit testing; radiation hardening (electronics); silicon-on-insulator; SET; Si; collected charge; fall time; integrated circuits; laser-induced transients; metal spacing; partially depleted silicon-on-insulator complementary-metal-oxide-semiconductor technology; poly-crystalline silicon gate; poly-silicon layers; pulse maximum; pulse width; pulsed laser irradiated test patterns; pulsed-laser single event transient testing; rise time; silicide technology; size 0.18 mum; soft errors; Lasers; Logic gates; Metals; Resistors; Silicides; Silicon; Transient analysis; charge collection; laser test; partially-depleted silicon-on-insulator; single event transient; soft errors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures (ICMTS), 2014 International Conference on
Conference_Location :
Udine
ISSN :
1071-9032
Print_ISBN :
978-1-4799-2193-5
Type :
conf
DOI :
10.1109/ICMTS.2014.6841494
Filename :
6841494
Link To Document :
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