• DocumentCode
    163148
  • Title

    Test structure to evaluate the impact of neighboring features on stress of metal interconnects

  • Author

    Smith, Brian ; Shroff, Mohit

  • Author_Institution
    Freescale Semicond., Inc., Austin, TX, USA
  • fYear
    2014
  • fDate
    24-27 March 2014
  • Firstpage
    213
  • Lastpage
    218
  • Abstract
    The stress-inducing effects of neighboring metal interconnect features were studied using novel stressmigration test structures with various layouts of perpendicular neighboring combs. The structures with narrow widths showed no change in stressmigration performance, with or without near-neighbor structures. However, structures built with wider lines showed up to 3X worse stressmigration performance when perpendicular combs were present nearby, essentially independent of the spacing to the combs. Thus, near neighbor metal features were shown to be capable of degrading SM performance in some lines.
  • Keywords
    integrated circuit interconnections; integrated circuit layout; integrated circuit testing; micromechanical devices; thermal stresses; SM performance degradation; near neighbor metal features; near-neighbor structures; neighboring metal interconnect; perpendicular neighboring comb layout; stress-induced voiding; stress-inducing effects; stress-migration test structures; thermal stress; Aerospace electronics; Layout; Metals; Resistance; Stress; Stress measurement; Temperature measurement; stress; test structure; voiding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures (ICMTS), 2014 International Conference on
  • Conference_Location
    Udine
  • ISSN
    1071-9032
  • Print_ISBN
    978-1-4799-2193-5
  • Type

    conf

  • DOI
    10.1109/ICMTS.2014.6841495
  • Filename
    6841495