DocumentCode
163148
Title
Test structure to evaluate the impact of neighboring features on stress of metal interconnects
Author
Smith, Brian ; Shroff, Mohit
Author_Institution
Freescale Semicond., Inc., Austin, TX, USA
fYear
2014
fDate
24-27 March 2014
Firstpage
213
Lastpage
218
Abstract
The stress-inducing effects of neighboring metal interconnect features were studied using novel stressmigration test structures with various layouts of perpendicular neighboring combs. The structures with narrow widths showed no change in stressmigration performance, with or without near-neighbor structures. However, structures built with wider lines showed up to 3X worse stressmigration performance when perpendicular combs were present nearby, essentially independent of the spacing to the combs. Thus, near neighbor metal features were shown to be capable of degrading SM performance in some lines.
Keywords
integrated circuit interconnections; integrated circuit layout; integrated circuit testing; micromechanical devices; thermal stresses; SM performance degradation; near neighbor metal features; near-neighbor structures; neighboring metal interconnect; perpendicular neighboring comb layout; stress-induced voiding; stress-inducing effects; stress-migration test structures; thermal stress; Aerospace electronics; Layout; Metals; Resistance; Stress; Stress measurement; Temperature measurement; stress; test structure; voiding;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures (ICMTS), 2014 International Conference on
Conference_Location
Udine
ISSN
1071-9032
Print_ISBN
978-1-4799-2193-5
Type
conf
DOI
10.1109/ICMTS.2014.6841495
Filename
6841495
Link To Document