• DocumentCode
    1631597
  • Title

    Mixed-mode simulation-design for IEC-ESD protection

  • Author

    Yao, Fei ; Xin Wang ; Shijun Wang ; Qin, Bo ; Wang, Shijun ; Chen, Hongyi ; Fan, Siqiang ; Zhao, Bin

  • Author_Institution
    CitrusCom Semicond., Hong Kong, China
  • fYear
    2010
  • Firstpage
    1596
  • Lastpage
    1599
  • Abstract
    Electrostatic discharge (ESD) protection becomes essential to advanced integrated circuits (IC). Very fast IEC-ESD failure and protection design are emerging challenges for contemporary ICs, particularly for consumer and portable electronics. This paper presents a new mixed-mode IEC-ESD simulation-design method, which involves process, device, circuit and system level simulation to accurately address the ultra-fast IEC ESD phenomena. The new IEC-ESD design technique allows ESD design optimization and prediction. Experimental results are depicted to validate the new design technique.
  • Keywords
    IEC standards; electrostatic discharge; integrated circuit design; integrated circuit reliability; mixed analogue-digital integrated circuits; IC reliability; IEC-ESD failure; IEC-ESD protection; advanced integrated circuits; circuit level simulation; consumer electronics; electrostatic discharge protection; mixed-mode simulation-design; portable electronics; system level simulation; Current measurement; Electrostatic discharge; IEC; IEC standards; Integrated circuit modeling; Testing; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5797-7
  • Type

    conf

  • DOI
    10.1109/ICSICT.2010.5667438
  • Filename
    5667438