• DocumentCode
    1632687
  • Title

    Mini environment systems. Enabling technology for flexible fabs of the future

  • Author

    Baldwin, Kevin ; Castrucci, Paul ; Williams, Malcolm

  • Author_Institution
    Asyst Technol., Milpitas, CA, USA
  • fYear
    1994
  • Firstpage
    10
  • Abstract
    Summary form only given. As the industry moves from one generation of IC technology to the next with smaller and smaller submicron devices and larger and larger wafers, severe constraints will be placed on manufacturing fabs. Conventional fabs typically have four generations of product running at once: advanced technology in development; growing technology ramping-up; current technology at its peak; and one generation declining and going out. Fab flexibility will be a key requirement as technological changes demand substantial tooling changes. We will describe a Minienvironment System that integrates the many tooling and process requirements the “Fab of the Future”
  • Keywords
    integrated circuit manufacture; IC technology; flexible fabs of the future; manufacturing; mini environment systems; submicron devices; tooling; wafer processing; Manufacturing industries; Manufacturing processes; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
  • Conference_Location
    Cambridge, MA
  • Print_ISBN
    0-7803-2053-0
  • Type

    conf

  • DOI
    10.1109/ASMC.1994.588155
  • Filename
    588155