DocumentCode
1632687
Title
Mini environment systems. Enabling technology for flexible fabs of the future
Author
Baldwin, Kevin ; Castrucci, Paul ; Williams, Malcolm
Author_Institution
Asyst Technol., Milpitas, CA, USA
fYear
1994
Firstpage
10
Abstract
Summary form only given. As the industry moves from one generation of IC technology to the next with smaller and smaller submicron devices and larger and larger wafers, severe constraints will be placed on manufacturing fabs. Conventional fabs typically have four generations of product running at once: advanced technology in development; growing technology ramping-up; current technology at its peak; and one generation declining and going out. Fab flexibility will be a key requirement as technological changes demand substantial tooling changes. We will describe a Minienvironment System that integrates the many tooling and process requirements the “Fab of the Future”
Keywords
integrated circuit manufacture; IC technology; flexible fabs of the future; manufacturing; mini environment systems; submicron devices; tooling; wafer processing; Manufacturing industries; Manufacturing processes; Semiconductor device manufacture;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
Conference_Location
Cambridge, MA
Print_ISBN
0-7803-2053-0
Type
conf
DOI
10.1109/ASMC.1994.588155
Filename
588155
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