Title :
Frequency temperature behavior of bi-mesa shaped at cut quartz resonators
Author :
Goka, Shigeyoshi ; Sekimoto, Hitoshi ; Watanabe, Yasuaki ; Sato, Takayuki
Author_Institution :
Tokyo Metropolitan Univ., Japan
fDate :
6/23/1905 12:00:00 AM
Abstract :
To confirm the effect of bi-mesa structures on the decoupling of thickness-shear (TS) and thickness-flexure (TF) modes, we measured the frequency-temperature behavior of bi-mesa shaped AT cut quartz resonators. The TF mode couples with the TS mode because the same displacement component is contained within the TS mode. This strong coupling cannot be eliminated as long as the plates have boundaries. Therefore, the temperature characteristics of the fundamental TS mode are clearly affected by the TF components. Bi-mesa structures have an energy trapping effect large enough to spatially separate the vibrational modes, so bi-mesa structures can decrease the effect of TF components. Therefore, the frequency-temperature behavior of a bi-mesa resonator is close to that of an infinite plate, which has no TF component effect. The bi-mesa resonators used in this study were fabricated using a wet etching process, and the fundamental TS frequency was 8.3 MHz. The frequency-temperature behavior was measured using a network analyzer. Results showed that bi-mesa resonators have temperature characteristics four times better than those of flat resonators, ranging from -20 to 85°C. These results confirm the energy trapping effect of bi-mesa structures and their effectiveness in separating vibrational modes
Keywords :
coupled mode analysis; crystal resonators; frequency stability; vibrations; 8.3 MHz; AT cut quartz resonators; SiO2; bi-mesa shaped resonators; decoupling; displacement component; energy trapping effect; frequency temperature behavior; fundamental frequency; infinite plate; network analyzer; thickness-flexure modes; thickness-shear modes; vibrational modes; wet etching process; Electric variables measurement; Fabrication; Frequency measurement; Resonance; Shape measurement; Size measurement; Springs; Temperature distribution; Thickness measurement; Wet etching;
Conference_Titel :
Frequency Control Symposium and PDA Exhibition, 2001. Proceedings of the 2001 IEEE International
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-7028-7
DOI :
10.1109/FREQ.2001.956355