Title :
A novel low loss, thin film, WLAN antenna switching module
Author :
Chen, Richard ; Mellen, Neal ; Shibata, Makoto ; Miyazaki, Masahiro ; Furuya, Akira
Author_Institution :
TDK R&D Corp., Phoenix, AZ
Abstract :
Thin film passives facilitate the design of reduced size components required for consumer wireless products when compared to current PCB or LTCC solutions. This paper describes the development of a low-loss, thin film process and subsequent fabrication of a WLAN antenna switch module. Parts were fabricated using both a typical Au based MMIC process and a reduced RF loss Cu process. Inductor Q was doubled and loss reduced by about .3 - .4 dB for Tx and Rx channels by using the low-loss Cu process
Keywords :
MMIC; antennas; modules; telecommunication channels; telecommunication switching; thin film circuits; wireless LAN; Au; Au based MMIC process; Cu; LTCC solutions; PCB solutions; Rx channel; Tx channel; consumer wireless products; low loss thin film WLAN antenna switching module; reduced RF loss Cu process; reduced size components; Costs; Dielectric materials; Dielectric substrates; Passive circuits; Radio frequency; Semiconductor materials; Switches; Thin film inductors; Transistors; Wireless LAN;
Conference_Titel :
Wireless Technology, 2005. The European Conference on
Conference_Location :
Paris
Print_ISBN :
2-9600551-1-X
DOI :
10.1109/ECWT.2005.1617718
