DocumentCode
1634226
Title
A novel low loss, thin film, WLAN antenna switching module
Author
Chen, Richard ; Mellen, Neal ; Shibata, Makoto ; Miyazaki, Masahiro ; Furuya, Akira
Author_Institution
TDK R&D Corp., Phoenix, AZ
fYear
2005
Firstpage
305
Lastpage
308
Abstract
Thin film passives facilitate the design of reduced size components required for consumer wireless products when compared to current PCB or LTCC solutions. This paper describes the development of a low-loss, thin film process and subsequent fabrication of a WLAN antenna switch module. Parts were fabricated using both a typical Au based MMIC process and a reduced RF loss Cu process. Inductor Q was doubled and loss reduced by about .3 - .4 dB for Tx and Rx channels by using the low-loss Cu process
Keywords
MMIC; antennas; modules; telecommunication channels; telecommunication switching; thin film circuits; wireless LAN; Au; Au based MMIC process; Cu; LTCC solutions; PCB solutions; Rx channel; Tx channel; consumer wireless products; low loss thin film WLAN antenna switching module; reduced RF loss Cu process; reduced size components; Costs; Dielectric materials; Dielectric substrates; Passive circuits; Radio frequency; Semiconductor materials; Switches; Thin film inductors; Transistors; Wireless LAN;
fLanguage
English
Publisher
ieee
Conference_Titel
Wireless Technology, 2005. The European Conference on
Conference_Location
Paris
Print_ISBN
2-9600551-1-X
Type
conf
DOI
10.1109/ECWT.2005.1617718
Filename
1617718
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