Title :
Fabrication and characterization of hybrid nanodots for floating gate application
Author :
Miyazaki, Seiichi
Author_Institution :
Grad. Sch. of Eng., Nagoya Univ., Nagoya, Japan
Abstract :
We have designed and fabricated hybrid nanodots (NDs) structures, in which Si quantum dots (QDs) as charge counting nodes and either Ni- or Pt-silicide NDs as charge storage nodes are stacked with an ultrathin SiO2 interlayer, to realize novel functional floating gate (FG) leading to both large memory windows and multi-valued capability. In the fabrication process, self-assembling of high-density Si-QDs on ultrathin SiO2 in the early stages of chemical vapor deposition (CVD) using SiH4 and the full-silicidation of pre-grown Si-QDs promoted with remote H2-plasma exposure after metal evaporation were controlled precisely. From characteristics of MOS capacitors and nMOSFETs with a hybrid FG, stable storage of many charges in the deep potential well of each silicide ND and stepwise charge injection to and emission from silicide NDs through discrete energy states in Si-QDs were confirmed. In addition, by 1310nm (~0.95eV) light irradiation, a distinct optical response in C-V characteristics was detected, which can be interpreted in terms of the shift of charge centroid in the hybrid FG stack due to transfer of photoexcited electrons from silicide NDs to the Si-QDs.
Keywords :
MOS capacitors; MOSFET; chemical vapour deposition; quantum dots; C-V characteristics; MOS capacitors; Si quantum dots; charge centroid; charge counting nodes; charge storage nodes; chemical vapor deposition; floating gate application; functional floating gate; hybrid nanodots structures; large memory windows; light irradiation; metal evaporation; multivalued capability; nMOSFETs; optical response; photoexcited electrons; stepwise charge injection; ultrathin SiO2 interlayer; Capacitance-voltage characteristics; Logic gates; MOS capacitors; Metals; Radiation effects; Silicides; Silicon;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-5797-7
DOI :
10.1109/ICSICT.2010.5667554