DocumentCode
1634558
Title
Electrical and testing reliability of Cux O based RRAM
Author
Wan, Haijun ; Tian, Xiaopeng ; Song, Yali ; Luo, Wenjin ; Wang, Ming ; Wang, Yanliang ; Zhou, Peng ; Lin, Yinyin
Author_Institution
ASIC & Syst. State Key Lab., Fudan Univ., Shanghai, China
fYear
2010
Firstpage
1100
Lastpage
1102
Abstract
This work studies the electrical and testing reliability issues of CuxO based RRAM (Resistive Random Access Memory). Firstly, we study the most important electrical reliability issue-data retention capability, and propose a filament/charge trap combined model to clarify the retention failure mechanism. Secondly, we respectively study the reliability problems caused by the SET compliance current in 1R-architecture and 1T1R-architecture devices during the electrical testing, and observe the compliance current overshoot phenomenon for the first time in 1R-architecture device by using a self-build compliance current capturing system.
Keywords
copper compounds; integrated circuit reliability; integrated circuit testing; random-access storage; 1T1R-architecture devices; CuxO; RRAM; SET compliance current; electrical reliability; electrical reliability issue-data retention capability; electrical testing; filament-charge trap combined model; resistive random access memory; retention failure mechanism; self-build compliance current capturing system; Copper; Equations; Mathematical model; Parasitic capacitance; Reliability; Testing; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-5797-7
Type
conf
DOI
10.1109/ICSICT.2010.5667559
Filename
5667559
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