Title :
Low-temperature activation of boron in silicon by soft X-ray irradiation
Author :
Heya, Akira ; Matsuo, Naoto ; Kanda, K. ; Noguchi, Takashi
Author_Institution :
Dept. of Mater. Sci. & Chem., Univ. of Hyogo, Himeji, Japan
Abstract :
Novel activation method of B dopant using soft X-ray undulator was examined. As the photon energy of irradiated soft X-ray closed to the energy of core level of Si 2p, the activation ratio was increased. The effect of soft X-ray irradiation on B activation was remarkable at temperature lower than 400°C. The activation energy of B activation by soft X-ray irradiation (0.06 eV) was lower than that of B activation by thermal annealing (0.18 eV). The activation of B dopant occurs at low temperature, although the activation ratio shows small values of 6.2×10-3 at 110°C.
Keywords :
X-ray effects; annealing; boron; core levels; elemental semiconductors; ion implantation; semiconductor doping; silicon; B activation; B dopant activation; Si 2p core level energy; Si:B+; activation energy; activation ratio; boron in silicon; irradiated soft X-ray; low-temperature activation; photon energy; soft X-ray irradiation effect; soft X-ray undulator; temperature 110 degC; thermal annealing; Annealing; Photonics; Radiation effects; Resistance; Silicon; Temperature measurement; Undulators;
Conference_Titel :
Junction Technology (IWJT), 2014 International Workshop on
Conference_Location :
Shanghai
DOI :
10.1109/IWJT.2014.6842022