Title :
Design and analysis of on-chip symmetric parallel-plate coupled-line balun for silicon RF integrated circuits
Author :
Yang, H.Y.D. ; Castaneda, Jesus A.
Author_Institution :
Broadcorn Corp., El Segundo, CA, USA
Abstract :
In this paper, we present the design and analysis of an on-chip transformer balun for silicon RFIC. High-performance on-chip transformer baluns for low-noise amplifiers and power amplifiers on multi-layer radio-frequency integrated circuits are constructed. Single-end primary and differential secondary are constructed on different dielectric surface planes. The metal windings of the primary and secondary are in parallel to form coupled lines. Both the primary and the secondary are designed symmetrically for differential operation. Additional layer interfaces and vias are used to provide bridges to assure the geometric symmetry. Examples of designs with test results are discussed.
Keywords :
baluns; high-frequency transformers; radiofrequency integrated circuits; transformer windings; Si; design analysis; dielectric surface plane; differential secondary; low-noise amplifier; multilayer radiofrequency integrated circuit; on-chip transformer balun; parallel metal winding; power amplifier; silicon RFIC; single-end primary; symmetric parallel-plate coupled-line; Bridge circuits; Coupling circuits; Dielectrics; High power amplifiers; Impedance matching; Low-noise amplifiers; Radio frequency; Radiofrequency amplifiers; Radiofrequency integrated circuits; Silicon;
Conference_Titel :
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location :
Philadelphia, PA, USA
Print_ISBN :
0-7803-7695-1
DOI :
10.1109/MWSYM.2003.1211022