DocumentCode
163573
Title
Rotational implant menitoring recipe characterization
Author
Loi Chee Meng ; Tiong Ung Chiong ; Jing Bo Chao ; Park Ju Young ; Poh, Bryan
Author_Institution
X-FAB Sarawak Sdn. Bhd, Kuching, Malaysia
fYear
2014
fDate
18-20 May 2014
Firstpage
1
Lastpage
4
Abstract
For advance CMOS device manufacturing, HALO implant with high tilt angles (30-45°) and 4-rotational condition has become one of the critical implant steps defining device properties. However, from Ion Implanter tool hardware point of view, the rotation mechanism function is not able to be monitored or verified to be accurate. A failure to rotate will not generate any tool error on traditional implanter design while typical Ion Implant dose monitoring by sheet resistance (Rs) on bare wafer is not sensitive to detect failure due to no device structure existence. In this paper we illustrates process control with new Ion Implantation method that been developed by using bare silicon wafer which is capable to provide in-line detection of rotation failure induced by hardware failure.
Keywords
CMOS integrated circuits; failure analysis; integrated circuit manufacture; integrated circuit reliability; ion implantation; 4-rotational condition; CMOS device manufacturing; HALO implant; Si; bare silicon wafer; device properties; failure detection; hardware failure; high tilt angles; in-line detection; ion implant dose monitoring; ion implanter tool; rotation failure; rotation mechanism function; rotational implant monitoring recipe characterization; sheet resistance; CMOS integrated circuits; Hardware; Implants; Manufacturing; Monitoring; Resistance; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology (IWJT), 2014 International Workshop on
Conference_Location
Shanghai
Type
conf
DOI
10.1109/IWJT.2014.6842030
Filename
6842030
Link To Document