DocumentCode :
163575
Title :
Ambient-controlled scanning spreading resistance microscopy (AC-SSRM) profiling study of advanced doping technologies
Author :
Shu Qin ; Zhiyong Suo ; Fillmore, David ; Shifeng Lu
Author_Institution :
Micron Technol. Inc., Boise, ID, USA
fYear :
2014
fDate :
18-20 May 2014
Firstpage :
1
Lastpage :
4
Abstract :
An ambient-controlled scanning spreading resistance microscopy (AC-SSRM) method and apparatus have been developed for one-dimensional (1D) and two-dimensional (2D) doping profiling measurement. 1D SSRM profiling on blanket (vertical) B-doped Si wafers are conducted to obtain spreading resistance profile SR(x). Modeling is used to convert SR(x) to carrier profile n(x). Replacing the average mobility (μ) with a calibration using μ(x) the carrier (hole) profile n(x) is more accurate. This is especially pronounced near the surface and junction depth (xj) and is consistent with continuous anodic oxidation technique/differential Hall effect (CAOT/DHE) measured carrier profiles. AC-SSRM method is utilized to evaluate both of the conventional beam-line ion implant and plasma doping (PLAD). The results demonstrate a fair consistence with other doping profiling techniques including electron holography and CAOT/DHE. The results also demonstrate a good correlation with PMOS device electrical performance.
Keywords :
Hall mobility; atomic force microscopy; boron; calibration; doping profiles; electron holography; elemental semiconductors; hole mobility; ion implantation; oxidation; semiconductor doping; silicon; 1D SSRM profiling; PMOS device electrical performance; Si:B; advanced doping technologies; ambient-controlled scanning spreading resistance microscopy; apparatus; average mobility; blanket vertical B-doped Si wafers; calibration; carrier hole profile; carrier profile; continuous anodic oxidation technique-differential Hall effect measured carrier profiles; conventional beam-line ion implant; doping profiling techniques; electron holography; junction depth; one-dimensional doping profiling measurement; plasma doping; surface depth; two-dimensional doping profiling measurement; Doping; Electrical resistance measurement; Implants; Probes; Resistance; Semiconductor process modeling; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology (IWJT), 2014 International Workshop on
Conference_Location :
Shanghai
Type :
conf
DOI :
10.1109/IWJT.2014.6842031
Filename :
6842031
Link To Document :
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