Title :
Photonic packaging for optical communications systems-basics and applications
Author_Institution :
Harz Univ. of Appl. Studies & Res., Wernigerode
Abstract :
In this report, different fiber-chip coupling concepts are presented. Automated coupling process, as well as different modules for laser welding, gluing and mechanical fixation are also discussed. Thermal stress tests are reported
Keywords :
laser beam welding; modules; optical fibre communication; optical fibre couplers; packaging; automated coupling process; fiber-chip coupling; gluing; laser welding; mechanical fixation; modules; optical communications systems; photonic packaging; thermal stress tests; Circuit testing; High speed optical techniques; Optical fiber communication; Optical fiber devices; Optical fiber networks; Optical fiber theory; Optical modulation; Optical receivers; Optical transmitters; Packaging;
Conference_Titel :
Photonics and Microsystems, 2005. Proceedings of 2005 International Students and Young Scientists Workshop
Conference_Location :
Dresden
Print_ISBN :
0-7803-9160-8
DOI :
10.1109/STYSW.2005.1617791
