DocumentCode
1635883
Title
Photonic packaging for optical communications systems-basics and applications
Author
Fischer, U.H.P.
Author_Institution
Harz Univ. of Appl. Studies & Res., Wernigerode
fYear
2005
Firstpage
27
Lastpage
31
Abstract
In this report, different fiber-chip coupling concepts are presented. Automated coupling process, as well as different modules for laser welding, gluing and mechanical fixation are also discussed. Thermal stress tests are reported
Keywords
laser beam welding; modules; optical fibre communication; optical fibre couplers; packaging; automated coupling process; fiber-chip coupling; gluing; laser welding; mechanical fixation; modules; optical communications systems; photonic packaging; thermal stress tests; Circuit testing; High speed optical techniques; Optical fiber communication; Optical fiber devices; Optical fiber networks; Optical fiber theory; Optical modulation; Optical receivers; Optical transmitters; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Photonics and Microsystems, 2005. Proceedings of 2005 International Students and Young Scientists Workshop
Conference_Location
Dresden
Print_ISBN
0-7803-9160-8
Type
conf
DOI
10.1109/STYSW.2005.1617791
Filename
1617791
Link To Document