DocumentCode :
163605
Title :
Impact of carbon on diffusion and activation of arsenic in silicon
Author :
Itokawa, Hiroshi ; Mizushima, Ichiro
Author_Institution :
Semicond. & Storage Products Co., Toshiba Corp., Kawasaki, Japan
fYear :
2014
fDate :
18-20 May 2014
Firstpage :
1
Lastpage :
4
Abstract :
We successfully characterized an influence of carbon (C) on diffusion and activation of arsenic (As) atoms in silicon (Si) with different C contents less than ~1 at.% and As concentrations higher than ~7 × 1019 cm-3 after high-temperature annealing. It is experimentally found that As atoms segregate into interstitial site by C incorporation with an As concentration over ~1.4 × 1020 cm-3 after 1050 °C spike annealing, resulting in a decrease in the As activation ratio. This can be attributable that incorporated C atoms enhance a formation of inactive As vacancy cluster. In addition, Hall mobility is decreased with increasing C content, which may be interpreted in terms of the lattice strain and the point defects generated by the C incorporation. Furthermore, no significant impact of C on the As-diffusion is observable in the As-implanted layer with a fluence higher than 5 × 1014 cm-2 after 1050 °C spike annealing. As a result, the C incorporation marked increase the sheet resistance (ρs) of the As activation layer in Si.
Keywords :
Hall mobility; annealing; arsenic; carbon; doping profiles; elemental semiconductors; high-temperature effects; interstitials; silicon; surface diffusion; surface resistance; surface segregation; vacancies (crystal); As activation ratio; As concentrations; As-implanted layer; C contents; C incorporation; Hall mobility; Si:C,As; arsenic activation; arsenic atoms; arsenic diffusion; carbon impact; high-temperature annealing; inactive As vacancy cluster; interstitial site; lattice strain; point defects; segregation; sheet resistance; spike annealing; temperature 1050 degC; Annealing; Atomic layer deposition; Atomic measurements; Carbon; Hall effect; Lattices; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology (IWJT), 2014 International Workshop on
Conference_Location :
Shanghai
Type :
conf
DOI :
10.1109/IWJT.2014.6842047
Filename :
6842047
Link To Document :
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