• DocumentCode
    163605
  • Title

    Impact of carbon on diffusion and activation of arsenic in silicon

  • Author

    Itokawa, Hiroshi ; Mizushima, Ichiro

  • Author_Institution
    Semicond. & Storage Products Co., Toshiba Corp., Kawasaki, Japan
  • fYear
    2014
  • fDate
    18-20 May 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We successfully characterized an influence of carbon (C) on diffusion and activation of arsenic (As) atoms in silicon (Si) with different C contents less than ~1 at.% and As concentrations higher than ~7 × 1019 cm-3 after high-temperature annealing. It is experimentally found that As atoms segregate into interstitial site by C incorporation with an As concentration over ~1.4 × 1020 cm-3 after 1050 °C spike annealing, resulting in a decrease in the As activation ratio. This can be attributable that incorporated C atoms enhance a formation of inactive As vacancy cluster. In addition, Hall mobility is decreased with increasing C content, which may be interpreted in terms of the lattice strain and the point defects generated by the C incorporation. Furthermore, no significant impact of C on the As-diffusion is observable in the As-implanted layer with a fluence higher than 5 × 1014 cm-2 after 1050 °C spike annealing. As a result, the C incorporation marked increase the sheet resistance (ρs) of the As activation layer in Si.
  • Keywords
    Hall mobility; annealing; arsenic; carbon; doping profiles; elemental semiconductors; high-temperature effects; interstitials; silicon; surface diffusion; surface resistance; surface segregation; vacancies (crystal); As activation ratio; As concentrations; As-implanted layer; C contents; C incorporation; Hall mobility; Si:C,As; arsenic activation; arsenic atoms; arsenic diffusion; carbon impact; high-temperature annealing; inactive As vacancy cluster; interstitial site; lattice strain; point defects; segregation; sheet resistance; spike annealing; temperature 1050 degC; Annealing; Atomic layer deposition; Atomic measurements; Carbon; Hall effect; Lattices; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology (IWJT), 2014 International Workshop on
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/IWJT.2014.6842047
  • Filename
    6842047