• DocumentCode
    163632
  • Title

    Investigation of mixing Co in ultra-thin NiPt silicide films

  • Author

    Peng Xu ; Xiangbiao Zhou ; Chaochao Fu ; Jianfeng Pan ; Dongping Wu

  • Author_Institution
    State Key Lab. of ASIC & Syst., Fudan Univ., Shanghai, China
  • fYear
    2014
  • fDate
    18-20 May 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Influence of mixing Co on the structural stability of ultra-thin NiPt silicide film is investigated in this paper. Experiments of variation of the total thickness and Ni : Co : Pt ratio of the Ni, Co and Pt mixtures are carefully designed and carried out. Compared with the 6-nm NiPt sample silicide film, films of Ni, Co and Pt mixtures with similar total metal thickness demonstrate ~150 °C higher agglomeration temperature. The agglomeration temperature and phase transformation characteristics are found to be relatively stable, regardless of the variation of the total thickness and Ni : Co : Pt ratio in the Ni, Co and Pt mixtures.
  • Keywords
    alloying additions; cobalt alloys; metallic thin films; mixing; mixtures; nickel alloys; platinum alloys; silicon alloys; solid-state phase transformations; surface energy; Co mixing; Co1-xNixPtSi2; Ni-Co-Pt mixtures; Ni:Co:Pt ratio; Ni1-yPtyCoSi; NiPt sample silicide film; agglomeration temperature; phase transformation; size 6 nm; structural stability; total metal thickness; total thickness variation; ultrathin NiPt silicide films; Annealing; Films; Nickel; Resistance; Silicides; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology (IWJT), 2014 International Workshop on
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/IWJT.2014.6842061
  • Filename
    6842061
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=163632