Title :
Investigation of mixing Co in ultra-thin NiPt silicide films
Author :
Peng Xu ; Xiangbiao Zhou ; Chaochao Fu ; Jianfeng Pan ; Dongping Wu
Author_Institution :
State Key Lab. of ASIC & Syst., Fudan Univ., Shanghai, China
Abstract :
Influence of mixing Co on the structural stability of ultra-thin NiPt silicide film is investigated in this paper. Experiments of variation of the total thickness and Ni : Co : Pt ratio of the Ni, Co and Pt mixtures are carefully designed and carried out. Compared with the 6-nm NiPt sample silicide film, films of Ni, Co and Pt mixtures with similar total metal thickness demonstrate ~150 °C higher agglomeration temperature. The agglomeration temperature and phase transformation characteristics are found to be relatively stable, regardless of the variation of the total thickness and Ni : Co : Pt ratio in the Ni, Co and Pt mixtures.
Keywords :
alloying additions; cobalt alloys; metallic thin films; mixing; mixtures; nickel alloys; platinum alloys; silicon alloys; solid-state phase transformations; surface energy; Co mixing; Co1-xNixPtSi2; Ni-Co-Pt mixtures; Ni:Co:Pt ratio; Ni1-yPtyCoSi; NiPt sample silicide film; agglomeration temperature; phase transformation; size 6 nm; structural stability; total metal thickness; total thickness variation; ultrathin NiPt silicide films; Annealing; Films; Nickel; Resistance; Silicides; Silicon;
Conference_Titel :
Junction Technology (IWJT), 2014 International Workshop on
Conference_Location :
Shanghai
DOI :
10.1109/IWJT.2014.6842061
