• DocumentCode
    163666
  • Title

    Lanthana and its interface with silicon

  • Author

    Hei Wong

  • Author_Institution
    Dept. of Inf. Sci. & Electron. Eng., Zhejiang Univ., Hangzhou, China
  • fYear
    2014
  • fDate
    12-14 May 2014
  • Firstpage
    35
  • Lastpage
    41
  • Abstract
    In couple of years, the CMOS devices will be scaled down to the decananometer range and the gate dielectric thickness, in the sense of oxide equivalent thickness (EOT), will be shrunk into the subnanometer scale. A higher dielectric constant material must be introduced. Lanthanum oxide or lanthana has been considered to be one of the promising next generation gate dielectric materials. However, it was found that when lanthana is brought into contact with the silicon substrate, several undesirable effects, leading to significant device characteristic degradations, occur. In this review, some issues related to the material interaction at the lanthana/Si interface will be discussed. Some measures for overcoming the adverse effects of lanthana film, such as chemical doping and oxygen chemical potential control, will be highlighted.
  • Keywords
    CMOS integrated circuits; dielectric materials; integrated circuit reliability; lanthanum compounds; silicon; substrates; CMOS devices; EOT; La2O3-Si; chemical doping; complementary metal oxide semiconductor; decananometer range; device characteristic degradation; gate dielectric thickness; higher dielectric constant material; lanthana film adverse effect; lanthana-Si interface; lanthanum oxide; material interaction; next generation gate dielectric material; oxide equivalent thickness; oxygen chemical potential control; silicon interface; silicon substrate; subnanometer scale; undesirable effect; Dielectrics; Films; High K dielectric materials; Lanthanum; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics Proceedings - MIEL 2014, 2014 29th International Conference on
  • Conference_Location
    Belgrade
  • Print_ISBN
    978-1-4799-5295-3
  • Type

    conf

  • DOI
    10.1109/MIEL.2014.6842082
  • Filename
    6842082