Title :
Prognostics approach for power MOSFET under thermal-stress aging
Author :
Celaya, José R. ; Saxena, Abhinav ; Kulkarni, Chetan S. ; Saha, Sankalita ; Goebel, Kai
Author_Institution :
Prognostics Center of Excellence, NASA Ames Res. Center (SGT Inc.), Moffett Field, CA, USA
Abstract :
The prognostic technique for a power MOSFET presented in this paper is based on accelerated aging of MOSFET IRF520Npbf in a TO-220 package. The methodology utilizes thermal and power cycling to accelerate the life of the devices. The major failure mechanism for the stress conditions is die-attachment degradation, typical for discrete devices with lead-free solder die attachment. It has been determined that die-attach degradation results in an increase in ON-state resistance due to its dependence on junction temperature. Increasing resistance, thus, can be used as a precursor of failure for the die-attach failure mechanism under thermal stress. A feature based on normalized ON-resistance is computed from in-situ measurements of the electro-thermal response. An Extended Kalman filter is used as a model-based prognostics techniques based on the Bayesian tracking framework. The proposed prognostics technique reports on preliminary work that serves as a case study on the prediction of remaining life of power MOSFETs and builds upon the work presented in [1]. The algorithm considered in this study had been used as prognostics algorithm in different applications and is regarded as suitable candidate for component level prognostics. This work attempts to further the validation of such algorithm by presenting it with real degradation data including measurements from real sensors, which include all the complications (noise, bias, etc.) that are regularly not captured on simulated degradation data. The algorithm is developed and tested on the accelerated aging test timescale. In real world operation, the timescale of the degradation process and therefore the RUL predictions will be considerable larger. It is hypothesized that even though the timescale will be larger, it remains constant through the degradation process and the algorithm and model would still apply under the slower degradation process. By using accelerated aging data with actual device measurements and real sen- ors (no simulated behavior), we are attempting to assess how such algorithm behaves under realistic conditions.
Keywords :
Bayes methods; Kalman filters; power MOSFET; solders; thermal stresses; Bayesian tracking framework; accelerated aging data; accelerated aging test timescale; component level prognostics; die attachment degradation; die-attach failure mechanism; electrothermal response; extended Kalman filter; lead-free solder die attachment; model-based prognostics technique; power MOSFET; power cycling; prognostics algorithm; simulated degradation data; thermal stress aging; Accelerated aging; Degradation; Mathematical model; Power MOSFET; Prediction algorithms; Temperature measurement; Accelerated Life Test; PHM; Power MOSFET; Prognostics;
Conference_Titel :
Reliability and Maintainability Symposium (RAMS), 2012 Proceedings - Annual
Conference_Location :
Reno, NV
Print_ISBN :
978-1-4577-1849-6
DOI :
10.1109/RAMS.2012.6175487