DocumentCode
163814
Title
Robustness validation in qualification activities of integrated circuits for automotive industry
Author
Blyzniuk, M.
Author_Institution
Dept. of Reliability Assurance of Global Dev., Branch Establ. Melexis-Ukraine, Kiev, Ukraine
fYear
2014
fDate
12-14 May 2014
Firstpage
345
Lastpage
348
Abstract
Robustness validation results aimed at achieving lower ppm-failure rates by ensuring adequate guard band between the “real life” operation range of devices and the points at which device fails are presented. One of the main attentions was paid to package reliability (especially to bonding system reliability as major limitation factor) with combination of used different Bill of Material (BOM), different wafer technologies and different products.
Keywords
automotive electronics; integrated circuit packaging; integrated circuit reliability; automotive industry; bonding system reliability; integrated circuits; package reliability; qualification activities; robustness validation; Automotive engineering; Force; Integrated circuit reliability; Qualifications; Robustness; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics Proceedings - MIEL 2014, 2014 29th International Conference on
Conference_Location
Belgrade
Print_ISBN
978-1-4799-5295-3
Type
conf
DOI
10.1109/MIEL.2014.6842160
Filename
6842160
Link To Document