Title :
Robustness validation in qualification activities of integrated circuits for automotive industry
Author_Institution :
Dept. of Reliability Assurance of Global Dev., Branch Establ. Melexis-Ukraine, Kiev, Ukraine
Abstract :
Robustness validation results aimed at achieving lower ppm-failure rates by ensuring adequate guard band between the “real life” operation range of devices and the points at which device fails are presented. One of the main attentions was paid to package reliability (especially to bonding system reliability as major limitation factor) with combination of used different Bill of Material (BOM), different wafer technologies and different products.
Keywords :
automotive electronics; integrated circuit packaging; integrated circuit reliability; automotive industry; bonding system reliability; integrated circuits; package reliability; qualification activities; robustness validation; Automotive engineering; Force; Integrated circuit reliability; Qualifications; Robustness; Stress;
Conference_Titel :
Microelectronics Proceedings - MIEL 2014, 2014 29th International Conference on
Conference_Location :
Belgrade
Print_ISBN :
978-1-4799-5295-3
DOI :
10.1109/MIEL.2014.6842160
