DocumentCode :
1638166
Title :
A novel sidewall strained-Si channel nMOSFET
Author :
Liu, K.C. ; Wang, X. ; Quinones, E. ; Chen, X. ; Chen, X.D. ; Kencke, D. ; Anantharam, B. ; Chang, R.D. ; Ray, S.K. ; Oswal, S.K. ; Tu, C.Y. ; Banerjee, S.K.
Author_Institution :
Microelectron. Res. Center, Texas Univ., Austin, TX, USA
fYear :
1999
Firstpage :
63
Lastpage :
66
Abstract :
We fabricated a novel vertical sidewall strained-Si device without relaxed SiGe buffer layers in this work. The electrical performance has been characterized using C-V and I-V measurement. TEM pictures show a high quality crystalline tensile-strained-Si layer grown on the sidewall of a compressively-strained SiGe layer. The transconductance measurements of sidewall-tensile-strained Si n-MOSFETs exhibit the role of enhanced electron mobility as tensile strain increases. In addition to device results, theoretical sidewall conduction and valence band offset calculations, relative to the strained SiGe layer, are also presented.
Keywords :
MOSFET; capacitance; electron mobility; internal stresses; semiconductor device measurement; semiconductor device models; transmission electron microscopy; valence bands; C-V measurement; I-V measurement; SiGe-Si; TEM pictures; compressively-strained SiGe layer; electrical performance; enhanced electron mobility; high quality crystalline tensile-strained-Si layer; sidewall conduction; tensile strain; transconductance measurements; valence band offset; vertical sidewall strained-Si channel nMOSFET; Buffer layers; Capacitance-voltage characteristics; Crystallization; Electric variables measurement; Electron mobility; Germanium silicon alloys; MOSFET circuits; Silicon germanium; Strain measurement; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-5410-9
Type :
conf
DOI :
10.1109/IEDM.1999.823847
Filename :
823847
Link To Document :
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