DocumentCode :
1638592
Title :
Ultrathin hafnium oxide with low leakage and excellent reliability for alternative gate dielectric application
Author :
Byoung Hun Lee ; Laegu Kang ; Wen-Jie Qi ; Renee Nieh ; Yongjoo Jeon ; Katsunori Onishi ; Lee, J.C.
Author_Institution :
Microelectron. Res. Center, Texas Univ., Austin, TX, USA
fYear :
1999
Firstpage :
133
Lastpage :
136
Abstract :
Physical, electrical and reliability characteristics of ultra thin HfO/sub 2/ as an alternative gate dielectric were studied for the first time. Crucial process parameters of oxygen modulated dc magnetron sputtering were optimized to achieve an equivalent oxide thickness (EOT) of 11.5 /spl Aring/ without deducting the quantum mechanical effect. Leakage current was 3/spl times/10/sup -2/ A/cm/sup 2/ at +1 V. Excellent dielectric properties such as high dielectric constant, low leakage current, good thermal stability, negligible dispersion and good reliability were demonstrated.
Keywords :
dielectric thin films; hafnium compounds; leakage currents; permittivity; reliability; semiconductor device metallisation; sputter deposition; thermal stability; 11.5 angstrom; HfO/sub 2/; O/sub 2/; O/sub 2/ modulated dc magnetron sputtering; dielectric constant; dielectric properties; equivalent oxide thickness; gate dielectric; leakage current; low leakage; process parameters; quantum mechanical effect; reliability characteristics; thermal stability; ultrathin HfO/sub 2/; Dielectric materials; Electrodes; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Leakage current; Magnetic modulators; Quantum mechanics; Silicon; Sputtering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-5410-9
Type :
conf
DOI :
10.1109/IEDM.1999.823863
Filename :
823863
Link To Document :
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