DocumentCode :
1638881
Title :
A Spice-compatible flash EEPROM model feasible for transient and program/erase cycling endurance simulation
Author :
Chung, S.S. ; Yih, C.-M. ; Wu, S.S. ; Chen, H.H. ; Gary Hong
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
1999
Firstpage :
179
Lastpage :
182
Abstract :
A complete Spice-compatible model for stacked-gate flash EEPROM cells has been successfully developed. It includes an accurate DC I-V model, a gate current model for Channel Hot Electron (CHE) programming; and a channel Fowler-Nordheim (FN) current model for erase. Program and erase induced oxide damage are also included in the model. For the first time, it allows the simulation of the programming/erase transient and the P/E cycling endurance characteristics using the present analytical approach. It provides an easy way for applications to cell design optimization and reliability evaluation for device and circuit designers.
Keywords :
PLD programming; SPICE; flash memories; hot carriers; integrated circuit modelling; integrated circuit reliability; integrated memory circuits; transient analysis; tunnelling; CHE programming; DC I-V model; FN current model; MOSFET; Spice-compatible model; cell design optimization; channel Fowler-Nordheim current model; channel hot electron programming; erase induced oxide damage; flash EEPROM model; gate current model; program induced oxide damage; program/erase cycling endurance simulation; programming/erase transient; reliability evaluation; stacked-gate flash EEPROM cells; transient simulation; Analytical models; CMOS technology; Channel hot electron injection; Circuit simulation; Design optimization; EPROM; Flash memory; Flash memory cells; Nonvolatile memory; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-5410-9
Type :
conf
DOI :
10.1109/IEDM.1999.823874
Filename :
823874
Link To Document :
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