• DocumentCode
    1638883
  • Title

    Definition of the mechanical stress value in the IC pin leads

  • Author

    Pavlysh, Volodymyr ; Dyachok, Dmytro

  • Author_Institution
    Inst. of Telecommun., Radioelectron. & Electron., Nat. Univ. Lvivska Polytechnica, Lviv, Ukraine
  • fYear
    2008
  • Firstpage
    91
  • Lastpage
    91
  • Abstract
    The stressed state of the rigid connection of the IC chip and wiring substrate is presented. The mechanical stresses in the IC golden and soldered pin leads are calculated by the corrected formula. It is shown that with the increase of lead numbers the calculation accuracy by the proposed formula is increased.
  • Keywords
    integrated circuit testing; stress analysis; IC pin leads; mechanical stress value; rigid connection; soldered pin; wiring substrate; mechanical stress; pin lead;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2008 Proceedings of International Conference on
  • Conference_Location
    Lviv-Slavsko
  • Print_ISBN
    978-966-553-678-9
  • Type

    conf

  • Filename
    5423487
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1638883