DocumentCode :
1639169
Title :
Analysis of temperature distribution in switched reluctance linear launcher
Author :
Chen, H. ; Lv, S. ; Wang, Q. ; Iu, Herbert Ho-Ching
Author_Institution :
Sch. of Inf. & Electr. Eng., China Univ. of Min. & Technol., Xuzhou, China
fYear :
2012
Firstpage :
1
Lastpage :
6
Abstract :
This paper presents a thermal model of switched reluctance linear launcher. The accuracy of the thermal model is verified by comparing experimental data with those resulting derived from finite-element method (FEM) simulation. The temperature distribution of switched reluctance linear launcher is derived based on the stator copper losses as the main heat power measured the stator winding current by the current sensor. The maximum temperature rise curves with the different ambient temperature and the different heat power of the winding A, and the heat dissipation power of the 4 air convection surfaces with the different ambient temperature and the different heat power of the winding A are studied. Furthermore, this study achieves optimization in thickness of the stator plate and adding fins to the stator plate for heat dissipation with the present model. It is shown that the stator plate is the maximum heat dissipation power surface so that it can be adopted as the main heat dissipation channel and the effect of heat dissipation is obvious by adding fins to the stator plate.
Keywords :
cooling; electromagnetic launchers; stators; thermal analysis; FEM simulation; adding fins; air convection surfaces; ambient temperature; current sensor; finite-element method; heat dissipation channel; heat power; maximum heat dissipation power surface; maximum temperature rise curves; stator copper losses; stator plate; stator winding current; switched reluctance linear launcher; temperature distribution analysis; thermal model; Heating; Mathematical model; Stator windings; Switches; Temperature distribution; Windings;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Launch Technology (EML), 2012 16th International Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4673-0306-4
Type :
conf
DOI :
10.1109/EML.2012.6325087
Filename :
6325087
Link To Document :
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